Mechatronika MD 40
Mechatronika’s MD40 Liquid Dispensing System is a versatile automatic machine for dispensing solder paste, glue or virtually any viscous substances.
Mechatronika MR260 Forced Air Convection Reflow Oven
The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems.
Mechatronika MR10 Reflow Oven
Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying.
Mechatronika M80 V
Mechatronika’s M80 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 30 x 30 mm with a full vision, touchless component centering.
Mechatronika M70 V
Mechatronika’s M70 Pick and Place System is a versatile automatic machine for placing SMD components from 0201 to 35 x 35 mm with a full vision, touchless component centering.
Mechatronika M10 V
Mechatronika’s M10V Pick and Place System is a versatile automatic machine for placing SMD components from 0201 to 35 x 35 mm with a full vision, touchless component centering.
Mechatronika MM600
Mechatronika MM600 is a semi-automatic pick and place system for SMD components, that also allows dispensing of glue or solder paste on PCB.