Autotronik BA385V

Product Benefits

  • Medium to high volume
  • Reliable and easy to maintain
  • Cognex® Vision System provides high accuracy

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Technical Specification

The BA385 assures high-precision placement of the full range of SMDs, from the smallest 0201 devices through CSPs, µBGAs, flip-chips, ultra-fine pitch 0.3mm for QFPs, even odd-form components.

SUMMARY

• High Accuracy and high Flexibility for 01005, 0201, SOIC, PLCC, BGA, µBGA, CSP, QFP, up to fine-pitch 0.3mm

• Non-contact Linear Encoder System for high Repeatability and Stability

• Smart Feeder System provides Automatic feeder Position Checking, Automatic Component Counting, Production Data Traceability

• Perfect for medium & high volume Production

• COGNEX® Alignment System “Vision on the Fly”

• Bottom Vision Alignment System for fine pitch QFP & BGA

• Built in Camera System with Auto Smart Fiducial Mark Learning

• Dispenser system

• Vision Inspection before and after production

• Windows XP Software

• Universal CAD Conversion

• Placement rate: 8000 CP/H

• Ball Screw Systems in X- and Y-Axes

• Suitable for 128 intelligent Auto Tape Feeder

• Quick change Feeder Trolley