Mechatronika MR260 Forced Air Convection Reflow Oven

Product Benefits

  • Forced air convection heat to maximum temperatures up to 280┬░C.
  • Forced air convection provides uniform heating.
  • 4-channel PCB temperature registration

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Technical Specification

The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. All heating parameters and registered profiles can be easily observed on built-in 17″ LCD display.

By eliminating set-up time your production line can work to its fullest capacity.

The MR260 has three heating zones, one cooling zone; each independently controlled for accurate temperature profiles.  Digital PID regulators ensure high stability of each zone temperature. Output to external storage device for print-out program data and temperature profiles.