Mechatronika MM600
Mechatronika MM600 is a semi-automatic pick and place system for SMD components, that also allows dispensing of glue or solder paste on PCB.
Mechatronika M10 V
Mechatronika’s M10V Pick and Place System is a versatile automatic machine for placing SMD components from 0201 to 35 x 35 mm with a full vision, touchless component centering.
Mechatronika MX70
The MX70 Pick and Place System is a versatile automatic machine for placing SMD components from 0201 to 35 x 35 mm with full vision, touchless component centering.
Mechatronika MX80
The MX80 Pick and Place System is a versatile, economical, automatic machine for placing SMD components from 0201 to 35 x 35 mm with full vision, touchless component centering.
Mechatronika MR10 Reflow Oven
Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying.
Mechatronika MR260 Forced Air Convection Reflow Oven
The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems.
Mechatronika MD 40vs
Mechatronika’s MD40vs Liquid Dispensing System is a versatile automatic machine for dispensing solder paste, glue or virtually any viscous substances.
Mechatronika MD50vs
Mechatronika’s MD50vs Liquid Dispensing System is a versatile automatic machine for dispensing solder paste, glue or virtually any viscous substances.
Mechatronika MS20 Manual Stencil Printer
The MS20 Stencil Printer enables manual application of solder paste to PCB via a metal stencil.