Autotronik BA385V

Product Benefits

  • Medium to high volume
  • Reliable and easy to maintain
  • Cognex® Vision System provides high accuracy

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    Technical Specification

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    The BA385 assures high-precision placement of the full range of SMDs, from the smallest 0201 devices through CSPs, µBGAs, flip-chips, ultra-fine pitch 0.3mm for QFPs, even odd-form components.

    SUMMARY

    • High Accuracy and high Flexibility for 01005, 0201, SOIC, PLCC, BGA, µBGA, CSP, QFP, up to fine-pitch 0.3mm

    • Non-contact Linear Encoder System for high Repeatability and Stability

    • Smart Feeder System provides Automatic feeder Position Checking, Automatic Component Counting, Production Data Traceability

    • Perfect for medium & high volume Production

    • COGNEX® Alignment System “Vision on the Fly”

    • Bottom Vision Alignment System for fine pitch QFP & BGA

    • Built in Camera System with Auto Smart Fiducial Mark Learning

    • Dispenser system

    • Vision Inspection before and after production

    • Windows XP Software

    • Universal CAD Conversion

    • Placement rate: 8000 CP/H

    • Ball Screw Systems in X- and Y-Axes

    • Suitable for 128 intelligent Auto Tape Feeder

    • Quick change Feeder Trolley

     

     

     

     

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